Grinding Objects Sapphire wafers, silicon wafers, gallium arsenide, gallium nitride wafers. This abrasive wheel is primarily used for thinning and finishing semiconductor wafers
diamond
price_IDR210.000
HC Diamond 2
diamond
price_IDR210.000
This abrasive wheel is primarily used for thinning and finishing semiconductor wafers
Product Description
Grinding Objects Sapphire wafers, silicon wafers, gallium arsenide, gallium nitride wafers. This abrasive wheel is primarily used for thinning and finishing semiconductor wafers
